Anyone who has suffered the Red Ring of Death will know that when they see it on the beloved Xbox 360 console will know that it's time to send the console back to Microsoft to fix. But it new seems that will be a thing of the past as a new motherboard comes to the gaming platform.

Codenamed "Jasper" and previously spotted in the wild, the new 65nm AMD graphics chip is claimed to overcome the Xbox turning into a chip fryer.

According to Dean Takahashi, author of technical books on the Xbox 360's problems, the new chip could allow the company to finally put the issue behind it.

"The graphics chip will likely consume less power than previous versions, allowing it to fit snugly into its motherboard socket," he said. "That should lead to fewer system failures due to the graphics chips coming loose."

He said that the reason for mobo failure was down to "thermal fatigue" of the leaded C4 connections between the graphics chip die and its organic carrier.

"The underfill had too low a glass-transition temperature for the amount of heat generated. That caused cracking over time, resulting in graphics chips coming loose," he said.

The motherboard also features 256MB of onboard memory, meaning that the hard disc-less version of the console, the Arcade, can now be updated to run the New Xbox Experience dashboard.

The improved storage was confirmed by Microsoft to 360Fanboy. A Microsoft spokesperson said: "We are constantly updating the console's more than 1700 internal components. We can confirm that we are moving to internal memory for the Xbox 360 Arcade. The physical internal memory is the same size as the previous external memory units - 256MB."

New Xbox 360 colsoles sporting the new motherboard can be spotted by their 150W power supply.