who has suffered the Red Ring of Death will know that when they see it
on the beloved Xbox 360 console will know that it’s time to send the
console back to Microsoft to fix. But it new seems that will be a thing of the past as a new motherboard comes to the gaming platform.
Codenamed "Jasper" and previously spotted in the wild, the new 65nm AMD graphics chip is claimed to overcome the Xbox turning into a chip fryer.
According to Dean Takahashi,
author of technical books on the Xbox 360’s problems, the new chip
could allow the company to finally put the issue behind it.
"The graphics chip will likely consume less power than previous
versions, allowing it to fit snugly into its motherboard socket," he
said. "That should lead to fewer system failures due to the graphics
chips coming loose."
He said that the reason for mobo failure was down to "thermal fatigue"
of the leaded C4 connections between the graphics chip die and its
underfill had too low a glass-transition temperature for the amount of
heat generated. That caused cracking over time, resulting in graphics
chips coming loose," he said.
The motherboard also features 256MB of onboard memory, meaning that
the hard disc-less version of the console, the Arcade, can now be
updated to run the New Xbox Experience dashboard.
The improved storage was confirmed by Microsoft to 360Fanboy. A Microsoft spokesperson said: "We are constantly updating the
console’s more than 1700 internal components. We can confirm that we
are moving to internal memory for the Xbox 360 Arcade. The physical
internal memory is the same size as the previous external memory units
New Xbox 360 colsoles sporting the new motherboard can be spotted by their 150W power supply.